• Intel plans to release an eight-core version of the Nehalem CPU possibly in 2009. This processor will more than likely be an Extreme Edition model. Like Nehalem, it will be manufactured using a 45 nm process.
• Intel Westmere is scheduled for release sometime in 2009. Westmere is the die-shrunk 32 nm version of Nehalem.
• Mozilla Mobile Firefox is expected to be released sometime after 2008. Mobile Firefox is intended to be a web browser based on Firefox for mobile devices. Mobile Firefox will use technology developed for and shipped with Firefox 3. Mobile Firefox will supercede the development work that went into development of the Minimo mobile browser also developed by Mozilla.
• Intel Calpella is the code name for the successor to the Intel Montevina platform. Calpella will be the sixth Centrino generation and positioned to compete against AMD’s Fusion platform. It is thought to support the Gilo CPU which will be available in dual and quad core models.
• AMD Shrike platform is expected to be released at the same time as AMD Shift in 2009. The Shrike platform consists of the Shift CPU and its companion chipset. Shrike will include a next generation southbridge, support for AMD’s M9x discrete GPU’s, 802.11 a/b/g/n, 3G, DASH (desktop and mobile architecture for systems management hardware), and Ultra WideBand (UWB).
• Microsoft DirectX 11 is expected to be launched sometime in 2009. New features will include Tessellation/Displacement, Multithreaded Rendering, and Compute Shaders. It will also include support for Shader Model 5.0. DirectX will be included in Windows 7.
• Windows Vista Service Pack 2 (SP2) is expected to be released in early 2009.
• Intel Larrabee is expected to be launched sometime in 2009 with samples as early as Q4 2008. Larrabee is a multi-core, programmable general purpose graphics processors (GPGPU). It is a GPU, physics and scientific calculation chip all in one. It will use a tweaked x86 instruction set and be used for specialized applications. The GPU is expected to contain up to 16 cores and each core can execute up to 4 simultaneous threads allowing up to 64 total threads. Larrabee will be manufactured using Intel’s 45 nm process. Each core is thought to be able to operate at speeds above 2 GHz. Larrabee will introduce a new extension set called Advanced Vector Extensions which will be similar to Intel’s SSE extension sets. Larrabee will support OpenGL, DirectX and ray-tracing instructions. Larrabee will use GDDR5 memory.
• Intel Moorestown platform is expected to be launched in 2009. Moorestown is the next generation platform for MIDs and UMPCs and will replace Intel’s Menlow platform. Moorestown will consist of Lincroft CPU, Langwell IOH chipset, and EvansPeak comms chipset. Some devices based on Moorestown could see up to an 100% improvement in battery life due to a total system TDP of less than 2 Watts.
• Intel’s Lincroft CPU is expected to be launched in 2009 and will be part of the Moorestown platform. Lincroft will bring the graphics core and memory controller all into the processor itself. It will either be a 45 nm or 32 nm chip. It will include support for DDR3, PCIe, USB, and SATA. It will likely use Intel’s QuickPath Interconnect technology thus replacing the FSB.
• Intel’s Langwell IOH chipset is expected to be launched in 2009 and is a component of the Moorestown platform. Langwell will include support for solid state devices (SSD).
• AMD will launch the Hydra revision of its Shanghai CPU in early 2009. Hydra will be manufactured as a 45 nm K10.5 Rev D processor using a high-K process instead of silicon on insulator like previous revisions. Hydra should support up to 8 cores, 6MB L3 cache, and 1MB L2 cache per core.
• AMD RD890 chipset is due to be launched sometime in 2009, possibly Q2/H1. RD890 will support DDR3, socket AM3, and PCIe 3.0. It will interconnect with the new SB800 Southbridge. The SB800 will probably be the first Fusion technology supporting southbridge from AMD. SB800 will also include Gigabit Ethernet, 6 GB/s SATA, and 14 USB 2.0 ports. RD890 will likely replace the AMD 790FX chipset. The IGP chipset is code named RS880.
• PCI Express 3.0 specification is expected to be completed in 2009 and begin appearing on motherboards in the 2009/2010 timeframe. PCIe 3.0 will allow for increased transfers up to 8 gigatransfers per second (vs. 5 for PCIe 2.0). It is expected to use the same connector and thus be backwards compatible.
• AMD is currently developing a CPU for the MID/netbook market with an unknown due date; however, it is not likely to appear until at least 2009. Some sources indicate it could be available before the end of 2008. It will have a 1 GHz operating frequency and feature the AMD64 instruction set, integrated memory controller, a single DDR2-400 DIMM, 16-lane 800 MHz HyperTransport link, 64KB L1 instruction cache, 64KB L1 data cache, 256KB L2 cache, and a 8 Watt TDP. The BGA die size will be 27×27 mm and have 812 pins.
• ATI will release its R800, dual chip video card sometime in 2009. R800 will be a high-end, enthusiast card and will replace the R700.

H1 (1st Half)

• AMD Bulldozer is due to be released in H1 2009. AMD has said Bulldozer will be an all new processor containing up to 16 cores. AMD has said it will be their first substantially new CPU core since the Athlon 64 and the first complete re-design from the ground up since the K7 architecture. Bulldozer’s architecture is expected to provide the foundation for all future AMD CPU’s. Bulldozer will featuer a deeper instruction pipeline, new instructions for media processing and performance in high performance computing clusters. It will also have HT3.0, support for DDR3, and AMD’s G3MX memory extender technology to boost data and bandwidth available to the processor. At first, Bulldozer will be a 45 nm chip, but later reduced to 32 nm. Power usage is expected to be between 10 and 100 Watts.
• AMD Heka is a triple-core CPU tentatively scheduled for release in H1 2009. Heka will be a 45 nm processor and support both AM2+ and AM3. The AM2+ will have support for DDR2 and the AM3 version having support for DDR3. Two versions of the processor may be released, one with 6MB of shared L3 cache and the other without. The version without the L3 cache will be significantly cheaper. Heka CPUs may end up being a combination of Deneb and Propus processors when released.
• Microsoft Office 14 is tentatively expected to be launched sometime in H1; although it would not be unlikely for it to slip to H2 or even later. The Office 13 code name designation was skipped for superstituous reasons. Office 14’s new features and improvements over Office 2007 will focus on three main areas: Enterprise Content Management, Communication & Collaboration, and Business Process & Business Intelligence. Enterprise Content Management refers to the authoring, management, and organization of complex documents and content. Communication & Collaboration relates to keeping communities, co-workers, partners and customers in sync. Business Process & Business Intelligence is defined as making the right information available throughout the business process. The central focus of these three areas is the Individual Impact and in the words of Microsoft it is to “amplify the impact of your people”. Office 14 will more than likely have strong integration with SharePoint products as well as its other server-based offerings currently in development.

Q1 (1st Qtr)

• Intel Lynnfield is expected in Q1 2009. Lynnfield will be quad-core CPU’s based on the Nehalem architecture and targeted towards the performance mainstream market. Lynnfield will only come with a dual-channel DDR3 memory controller instead of the triple-channel one found on Bloomfield CPU’s. Lynnfield will include Hyper-Threading which will allow it to have 8 threads across the 4 cores. It will also include an integrated PCIe 2.0 controller which will limit it to single x16 graphics card or 2 x8 cards. Lynnfield will use a LGA 1160 socket and have 8 MB Intel Smart Cache.
• Intel Ibexpeak chipset is expected to be released at the same time as the Lynnfield and Havendale CPU’s in Q1 2009. Ibexpeak will be a single chip solution that will take over all the functions of the northbridge and southbridge with the exception of the memory controller which will be moved onto the CPU. Instead of using Intel’s newer Quick Path Interconnect, it will use the older DMI chipset interconnect.
• Intel plans to release an entry-level IGP chipset called the G41 in Q1 2009, but may be announced in Q4 2008. The G41 will probably be a feature-reduced version of the G43 chipset. It will likely lack the HDMI support that the G43 has.
• Intel Core 2 Quad Q9000, a quad-core, 45 nm mobile processor is expected to be announced in Q1. The Q9000 will be a 2 GHz CPU featuring a 1066 MHz FSB and 6 MB L2 cache.

Q2 (2nd Qtr)

• Intel Havendale is expected in Q2 2009. Havendale will be dual-core CPU’s based on the Nehalem architecture and targeted towards the entry-level to mainstream markets. Havendale CPU’s will include integrated graphics (1 x16). Havendale will use a LGA 1160 socket, include Hyper-Threading (4 threads across 2 cores), 4 MB Intel Smart Cache, and a 2-channel DDR3 integrated memory controller.
• Intel Clarkefield will be released at the end of Q2 2009. Clarkefield will be a quad-core Nehalem-based mobile processor. Greatly reduced power consumption will be one new feature of this CPU.
• Intel Auburndale will be released at the end of Q2 2009 around the same time as the Intel Clarkefield CPU. Auburndale will be a dual-core Nehalem-based mobile processor. Auburndale will feature integrated graphics. Like Clarkefield, Auburndale will feature significantly lower power consumption.
• Intel plans to launch a dual-core version of its low cost Diamondville CPU in either Q2 or Q3.

June

• Intel’s Montevina chipset will be refreshed.

H2 (2nd Half)

• AMD Montreal is tentatively scheduled to be launched in H2 2009. Montreal will be both an octa and quad-core 45 nm CPU. The octa-core CPU will be a native design, not just two quad-cores stuck together. Montreal will have 1MD L2 cache per core, 6MB to 12MB L3 cache, 4x HT links, AMD-V, and support DDR3 memory.
• AMD Falcon is tentatively scheduled for release in H2 2009. Falcon is supposed to be the first in the line of Fusion chips that will merge both graphics and CPU cores into a single die. These new processors will be powered by the new high performance execution core called Bulldozer and the Bobcat architecture. Falcon chips will feature graphics processing cores and high-definition video decoding engines.
• AMD Bobcat is penciled in for release sometime in H2 2009. Bobcat is an all-new ultra high efficiency multi-core x86 CPU design that will “revolutionise handheld devices”. Maximum power consumption should range from one to ten Watts. These CPU’s are expected to be used in digital TV’s.
• AMD Eagle should released at the same time as Falcon sometime in H2 2009. Eagle is AMD’s mobile optimized solution incorporating Falcon which combines the CPU and GPU into a single chip. Eagle will feature up to 4 CPU cores combined with an integrated GPU delivering enhanced graphics processing.
• AMD Swift mobile CPU is expected in H2 2009. Swift will be the 3rd generation “Stars” CPU and replace AMD Griffin CPU’s. It will include the GPU core and thus be the first AMD Fusion processor that combines the traditional CPU with graphics into a single chip. The CPU will come in two versions, the dual-core Black Swift and the single-core White Swift. The Swift CPU will support DDR3 and manufactured using a 45nm process. It is expected to use a new socket tentatively called “FS1″.
  

  2010 & Beyond

  

• Windows “7″ (Code names: Vienna and Windows Seven) is tentatively scheduled for release sometime January 2010. Windows “7″ will be a major release like Windows Vista. Some possible features include a new Windows Explorer, close integration with Windows Live, Next-Generation Secure Computing Base, “Hypervisor” (Windows Virtualization) technologies, and WinFS (Windows Future Storage) technologies. It might also utilize a modular approach such that only the modules chosen during installation are actually installed. The client version is supposed to be available in 32 and 64-bit editions; the server version will only be available in 64-bit.
• Intel’s Sandy Bridge (previously code named Gesher) is scheduled for release sometime in 2010. Sandy Bridge will be a new microprocessor architecture and is the successor to Nehalem. Sandy Bridge will be manufactured using the 32 nm processes. Sandy Bridge will probably integrate Intel’s Larrabee GPGPU.
• Intel Larabee is expected to be released in 2010. Larabee will contained integrated graphics and CPU cores. Intel has stated that the chip will be for use in scientific research, data mining, visualization, analytics, and other highly computing-intensive applications. It also expected to directly compete against ATI and nVidia’s graphics processors. Intel has said that Larabee will be the company’s first tera-scale processor, one capable of one trillion floating point operations (teraflops) per second.
• Intel Itanium (Code name: Poulson) is expected sometime in either 2010 or 2011 (but possibly as early as 2009). Poulson will be the successor to Intel Itanium (Tukwila) and be a major change in the microarchitecture for the Itanium line of processors. Poulson is expected to be built using a 32 nm process effectively skipping the 45 nm process for the Itanium series. It will have more cores and high performance threads than Tukwila. It is expected to have roughly 8 billion transistors or 4 times as many as Tukwila CPU’s.
• Intel Itanium (Code name: Kittson) will be released after Intel Itanium (Poulson).
• AMD plans to launch a new 6-8 core Opteron processor code named Sao Paolo in the first half of 2010. It be manufactured using a 45 nm process and will feature 12MB L3 cache, 4x HyperTransport 3.0 links, both registered and unregistered DDR3, and AMD-V. It will include support for something AMD calls Probe Filter which will increase performance in multi CPU systems by reducing cache coherency traffic. AMD will also include HTC which is a new power control method for over and underclocking the CPU on-demand. Sao Paolo will also infuse APML (Advanced Platform Management Link) which is similar to Intel’s vPro motherboard technology intended for enterprises.
• AMD intends to launch a new 12 core Opteron CPU code named Magny Cours in the first half of 2010. It will be identical in features to Sao Paolo.
• AMD is planning to launch a new server/workstation platform code named Maranello for Opteron processors in the first half of 2010. Maranello will have support for 4x HT-3 links and DDR3. It will probably be launched along with the Sao Paolo and Magny Cours CPU’s. It will introduce a new socket called Socket G34 and include the AMD RD890 chipset.
• Windows “8″ is expected to be released after 2012+.